ChipSourceTek MX2300C
The MX2300C uses advanced trench technology to provide excellent RDS(ON), low gate charge and operation with gate voltages as low as 2.5V. This device is suitable for use as a load switch or in PWM applications.| Part No. | MX2300C |
|---|---|
| Datasheet | MX2300C Download |
| Manufacturer |  ChipSourceTek |
| Description | N-Channel Power MOSFET |
| Buy | Stock & Price |
DESCRIPTION
MX2300C s GGENERAL FEATURES
● VDS =20V，ID =2.5A● RDS(ON)(Typ.) 52mΩ @ Vgs=4.5V
● RDS(ON)(Typ.) 72mΩ @ Vgs=2.5V 技
● High power and current handing capability k
● Lead free product is acquired
● Surface mount package 科 e Application T
● PWM applications
● Load switch 源特 rce
● Power management Schematic diagram 3 A2sHB 1 2 Marking and pin assignment 矽 ipSou SOT-23topview Ch
ABSOLUTE MAXIMUM RATINGS
(TA=25℃ unless otherwise noted) parameter symbol limit unit Drain-source voltage VDS 20 V Gate-source voltage VGS ±12 V Drain current-continuousa@Tj=125℃ -pulse db ID 2.5 A IDM 5 A Maximum power dissipation PD 0.35 W Operating junction Temperature range Tj -55—150 ℃ TEL: +86-0755-27595155 27595165 FAX: +86-0755-27594792 page 1 WEB: E-mail: Sales@ChipSourceTek.com Tony.Wang@ChipSourceTek.com MX2300CELECTRICAL CHARACTERISTICS
(TA=25℃ unless otherwise noted) Symbol Parameter Conditions Min Typ Max Unit On/Off States BVDSS Drain-Source Breakdown Voltage VGS=0V ID=250μA 20 V IDSS Zero...
