CEFM105 Datasheet | Comchip Technology

Features Ideal for surface mount applications Easy pick and place Plastic package has Underwriters Lab. flammability classification 94V-0 Super fast recovery time for high efficient Built-in strain relief Low forward voltage drop MINI SMA 0.161(4.10) 0.146(3.70) 0.012(0.30) Typ. 0.071(1.80) 0.055(1.40) Mechanical Data Case: Mini-SMA/SOD-123 molded plastic Terminals: solderable per MIL-STD-750, method 2026 Polarity: Color band denotes cathode end Mounting position: Any Approx. Weight:0.04 gram 0.035(0.90) Typ. 0.110(2.80) 0.094(2.40) 0.063(1.60) 0.055(1.40) 0.035(0.90) Typ. Dimensions in inches and (millimeter) Maximum Ratings and Electrical Characterics Parameter Max. Repetitive Peak Reverse Voltage Max. DC Blocking Voltage Max. RMS Voltage Peak Surge Forward Current 8.3ms single half sine-wave superimposed on rate load ( JEDEC method ) Max. Average Forward Current Max. Instantaneous Forward Current at 2.0 A Reverse recovery time Max. DC Reverse Current at Rated DC Blocking Voltage Ta=25 C Ta=100 C Typical. Thermal Resistance (Note 1) Operating Junction Temperature Storage Temperature Symbol V RRM V DC V RMS I FSM CEFM 101 50 50 35 CEFM 102 100 100 70 CEFM 103 200 200 140 CEFM 104 400 400 280 CEFM 105 600 600 420 Unit Io VF Trr IR R 0.875 25 1.1 35 1.25 50 A V n S u A 5.0 250 42 -55 to +150 -55 to +150 C/W C C Tj T STG Note 1: Thermal resistance from junction to lead P.C.B. Mounted on 8.0x8.0 mm copper pad areas. MDS0210021C Page 1 SMD Efficient Fast Recovery Rectifier CHIP .chip..tw Rating and Characteristic Curves (CEFM101 Thru CEFM105) Fig. 1 - Reverse Characteristics Fig.2 - Forward Characteristics CEFM101-103 Reverse Current ( u A ) Tj=125 C...