CDBQR00340 Datasheet | Comchip

Features Designed for mounting on small surface. Extremely thin package. Low stored charge. Majority carrier conduction. 0.026(0.65) 0.022(0.55) 0402(1005) 0.041(1.05) 0.037(0.95) Mechanical data Case: 0402(1005) standard package, molded plastic. Terminals: Gold plated, solderable per MIL-STD-750,method 2026. Polarity: Indicated by cathode band. Mounting position: Any Weight: 0.001 gram(approx.). 0.020(0.50) Typ. 0.012(0.30) Typ. 0.022(0.55) 0.018(0.45) Dimensions in inches and (millimeter) http://..net/ Maximum Rating (at T A =25 C unless otherwise noted) Parameter Repetitive peak reverse voltage Reverse voltage Average forward current Forward current,surge peak Power Dissipation Sunction temperature Junction temperature Conditions Symbol Min Typ Max Unit V RRM VR IO 45 40 30 500 200 -40 +125 +125 V V m A m A m W 8.3 ms single half sine-wave superimposed on rate load(JEDEC method) I FSM PD T STG Tj Electrical Characteristics (at T A =25 C unless otherwise noted) Parameter Forward voltage Reverse current Capacitance between terimnals V R = 30V V R = 40V Conditions I F = 1 m A DC Symbol Min Typ Max Unit VF IR CT 1.5 0.37 0.50 1.00 V u A p F F = 1 MHZ and 1 VDC reverse voltage REV:A QW-A1131 Page 1 chip Technology CO., LTD. datasheet pdf - http://..net/ SMD Schottky Barrier Diode SMD Diodes Specialist RATING AND CHARACTERISTIC CURVES (CDBQR00340) Fig. 1 - Forward characteristics 100m 1m Fig....