KLH00RXX3 Overview
Key Features
- DATE: 03/08/2005 NO
- These packages are formed by bonding 3 pcs of 40 mil LED chips on a 20mmx20mm metal PCB
- A heat sink is mechanically screwed to the board to cool down metal surface temperature below 70
- The main features of these packages are as follows l Very high flux output per LED
- l Flat PCB package
