DS21FT40 Datasheet PDF (Four x Three 12 Channel E1 Framer) | Download Dallas Semiconducotr DS21FT40

DS21FT40 - Four x Three 12 Channel E1 Framer

Description

The DS21FT40 MCM offers a high density packaging arrangement for the DS21Q44 E1 Enhanced Quad Framer.

Three DS21Q44 silicon die are packaged in a Multi-Chip Module (MCM) with the electrical connections as shown in Figure 1-1.

The DS21FT40 is closely related to the DS21FT44.

Features

Twelve (12) completely independent E1 Framers in one small 27 mm x 27 mm Package.
Each Multi-Chip Module (MCM) Contains Three DS21Q44 Quad E1 Framer Die.
Each Quad Framer can be concatenated into a Single 8.192 MHz Backplane Data Stream.
300.
pin MCM 1.27 mm pitch BGA package (27 mm X 27 mm).
Low Power 3.3V CMOS with 5V Tolerant Input & Outputs FRAMER.

Datasheet Details

Part number	DS21FT40
Manufacturer	Dallas Semiconducotr
File Size	386.04 KB
Description	Four x Three 12 Channel E1 Framer
Datasheet	DS21FT40 Datasheet
Additional preview pages of the DS21FT40 datasheet.

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Full PDF Text Transcription

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DS21FT40 Four x Three 12 Channel E1 Framer www.dalsemi.com MULTI-CHIP MODULE FEATURES • Twelve (12) completely independent E1 Framers in one small 27 mm x 27 mm Package • Each Multi-Chip Module (MCM) Contains Three DS21Q44 Quad E1 Framer Die • Each Quad Framer can be concatenated into a Single 8.192 MHz Backplane Data Stream • 300–pin MCM 1.27 mm pitch BGA package (27 mm X 27 mm) • Low Power 3.3V CMOS with 5V Tolerant Input & Outputs FRAMER FEATURES • All framers are fully independent; transmit and receive sections of each framer are fully independent • Frames to FAS, CAS, CCS, and CRC4 formats • Each framer contains dual two–frame elastic store slip buffers that can connect to asynchronous backplanes up to 8.

Published: Mar 30, 2005 |