DS21FT40 Overview
The DS21FT40 MCM offers a high density packaging arrangement for the DS21Q44 E1 Enhanced Quad Framer. Three DS21Q44 silicon die are packaged in a Multi-Chip Module (MCM) with the electrical connections as shown in Figure 1-1. The DS21FT40 is closely related to the DS21FT44.
DS21FT40 Key Features
- Twelve (12) pletely independent E1 Framers in one small 27 mm x 27 mm Package
- Each Multi-Chip Module (MCM) Contains Three DS21Q44 Quad E1 Framer Die
- Each Quad Framer can be concatenated into a Single 8.192 MHz Backplane Data Stream
- 300-pin MCM 1.27 mm pitch BGA package (27 mm X 27 mm)
- Low Power 3.3V CMOS with 5V Tolerant Input & Outputs
- All framers are fully independent; transmit and receive sections of each framer are fully independent
- Frames to FAS, CAS, CCS, and CRC4 formats
- Each framer contains dual two-frame elastic store slip buffers that can connect to asynchronous backplanes up to 8.192 M
- 8-bit parallel control port that can be used directly on either multiplexed or non- multiplexed buses (Intel or Motorola
- Easy access to Si and Sa bits
DS21FT40 Applications
- Integral HDLC controller with 64-byte buffers. Configurable for Sa bits or DS0 operation