DS21FT42 Overview
The Four x Four and Four x Three MCMs offer a high density packaging arrangement for the DS21Q42 T1 Enhanced Quad Framer. Either three (DS21FT42) or four (DS21FF42) silicon die of these devices is packaged in a Multi-Chip Module (MCM) with the electrical connections as shown in Figure 1-1. All of the functions available on the DS21Q42 are also available in the MCM packaged version.
DS21FT42 Key Features
- Sixteen (16) or Twelve (12) pletely Independent T1 Framers in One Small 27mm x 27mm Package
- Each Multi-Chip Module (MCM) Contains Four (FF) or Three (FT) DS21Q42 Die. Each Quad Framer Can be Concatenated into a S