Dense-Pac Microsystems DPS128M8
The DPS128M8CnY/BnY, DPS128X8CA3/BA3 High Speed SRAM devices are a revolutionary new memory subsystem using Dense-Pac Microsystems’ ceramic Stackable Leadless Chip Carriers (SLCC). These devices pack 1-Megabits of low-power CMOS static RAM in an area as small as 0.463 in2, while maintaining a total height as low as 0.082 inches. The SLCC devices contain an individual 128K x 8 SRAMs, each packaged in a hermetically sealed SLCC, making the modules suitable for commercial, industrial and military applications.| Part No. | DPS128M8 |
|---|---|
| Datasheet | DPS128M8 Download |
| Manufacturer |  Dense-Pac Microsystems |
| Description | 128kx8 High Speed CMOS SRAM |
| Buy | Stock & Price |
DESCRIPTION
: Available in straight leaded, ‘’J’’ leaded or gullwing leaded packages, or mounted on a 50-pin PGA co-fired ceramic substrate. The DPS128M8BnY/DPS128X8BA3 has one active low Chip Enable (CE) while the DPS128M8CnY/DPS128X8CA3 has an active low Chip Enable (CE) and an active high Select Line (SEL). By using SLCCs, the ‘’Stack’’ family of modules offer a higher board density of memory than available with conventional through-hole, surface mount or hybrid techniques. SLCC ‘’I’’ Leaded SLCCFEATURES
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● Organization Available: 128Kx8 Access Times: 20*, 25, 30, 35, 45ns Fully Static Operation - No clock or refresh required Single +5V Power Supply, ±10% Tolerance TTL Compatible Common Data Inputs and Outputs Low Data Retention Voltage: 2.0V min. Packages Available: 48 - Pin SLCC 48 - Pin Straight Leaded SLCC 48 - Pin ‘’J’’ Leaded SLCC 48 - Pin Gullwing Leaded SLCC 50 - Pin PGA Dense-Stack w w * Commercial only. w .D at Dense-Stack Gullwing Leaded SLCC aS he 30A097-31 REV.
