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DPS128M8 - 128kx8 High Speed CMOS SRAM

Download the DPS128M8 datasheet PDF. This datasheet also covers the DPS128M8_Dense variant, as both devices belong to the same 128kx8 high speed cmos sram family and are provided as variant models within a single manufacturer datasheet.

General Description

The DPS128M8CnY/BnY, DPS128X8CA3/BA3 High Speed SRAM devices are a revolutionary new memory subsystem using Dense-Pac Microsystems’ ceramic Stackable Leadless Chip Carriers (SLCC).

Key Features

  • Organization Available: 128Kx8 Access Times: 20.
  • , 25, 30, 35, 45ns Fully Static Operation - No clock or refresh required Single +5V Power Supply, ±10% Tolerance TTL Compatible Common Data Inputs and Outputs Low Data Retention Voltage: 2.0V min. Packages Available: 48 - Pin SLCC 48 - Pin Straight Leaded SLCC 48 - Pin ‘’J’’ Leaded SLCC 48 - Pin Gullwing Leaded SLCC 50 - Pin PGA Dense-Stack w w.
  • Commercial.

📥 Download Datasheet

Note: The manufacturer provides a single datasheet file (DPS128M8_Dense-PacMicrosystems.pdf) that lists specifications for multiple related part numbers.

Datasheet Details

Part number DPS128M8
Manufacturer Dense-Pac Microsystems
File Size 609.99 KB
Description 128kx8 High Speed CMOS SRAM
Datasheet download datasheet DPS128M8 Datasheet

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Other Datasheets by Dense-Pac Microsystems

Part Number Description
DPS128M8xxx 128kx8 High Speed CMOS SRAM
DPS128C32BV3 512kx8 High Speed CMOS SRAM
DPS128X32BV3 128kx32 High Speed CMOS SRAM
DPS128X32CV3 128kx32 High Speed CMOS SRAM

Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

View original datasheet text
1 Megabit High Speed CMOS SRAM DPS128M8CnY/BnY, DPS128X8CA3/BA3 DESCRIPTION: The DPS128M8CnY/BnY, DPS128X8CA3/BA3 High Speed SRAM devices are a revolutionary new memory subsystem using Dense-Pac Microsystems’ ceramic Stackable Leadless Chip Carriers (SLCC). Available in straight leaded, ‘’J’’ leaded or gullwing leaded packages, or mounted on a 50-pin PGA co-fired ceramic substrate. These devices pack 1-Megabits of low-power CMOS static RAM in an area as small as 0.463 in2, while maintaining a total height as low as 0.082 inches. The SLCC devices contain an individual 128K x 8 SRAMs, each packaged in a hermetically sealed SLCC, making the modules suitable for commercial, industrial and military applications.