DPS128M8xxx
DESCRIPTION
:
The DPS128M8Cn Y/Bn Y, DPS128X8CA3/BA3 High Speed SRAM devices are a revolutionary new memory subsystem using Dense-Pac Microsystems’ ceramic Stackable Leadless Chip Carriers (SLCC). Available in straight leaded, ‘’J’’ leaded or gullwing leaded packages, or mounted on a 50-pin PGA co-fired ceramic substrate. These devices pack 1-Megabits of low-power CMOS static RAM in an area as small as 0.463 in2, while maintaining a total height as low as 0.082 inches. The SLCC devices contain an individual 128K x 8 SRAMs, each packaged in a hermetically sealed SLCC, making the modules suitable for mercial, industrial and military applications. The DPS128M8Bn Y/DPS128X8BA3 has one active low Chip Enable (CE) while the DPS128M8Cn Y/DPS128X8CA3 has an active low Chip Enable (CE) and an active high Select Line (SEL). By using SLCCs, the ‘’Stack’’ family of modules offer a higher board density of memory than available with conventional through-hole, surface mount or hybrid techniques.
SLCC
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