DPS128X32CV3 Datasheet | Dense-Pac Microsystems

DESCRIPTION : The DPS128X32CV3/DPS128X32BV3 ‘’VERSA-STACK’’ module is a revolutionary new high speed memory subsystem using Dense-Pac Microsystems’ ceramic Stackable Leadless Chip Carriers (SLCC) mounted on a co-fired ceramic substrate. It offers 4 Megabits of SRAM in a package envelope of 1.090 x 1.090 x 0.252 inches. The DPS128X32CV3/DPS128X32BV3 contains four individual 128K x 8 SRAMs, packaged in their own hermetically sealed SLCCs making the module suitable for mercial, industrial and military applications. By using SLCCs, the ‘’Versa-Stack’’ family of modules offers a higher board density of memory than available with conventional through-hole, surface mount, module, or hybrid techniques. The DPS128X32BV3 has one active low Chip Enable (CE) and while the DPS128X32CV3 an active low Chip Enable (CE) and an active high Select Line (SEL). By using SLCCs, the ‘’Versa-Stack’’ family of modules offer a higher board density of memory than available with conventional through-hole,...