Dense-Pac Microsystems DPS128X32CV3
the DPS128X32CV3 an active low Chip Enable (CE) and an active high Select Line (SEL). By using SLCCs, the ‘’Versa-Stack’’ family of modules offer a higher board density of memory than available with conventional through-hole, surface mount or hybrid techniques. F et NOTE: SEL applies to the DPS128X32CV3 only, No Connect for the DPS128X32BV3 version.| Part No. | DPS128X32CV3 |
|---|---|
| Datasheet | DPS128X32CV3 Download |
| Manufacturer |  Dense-Pac Microsystems |
| Description | 128kx32 High Speed CMOS SRAM |
| Buy | Stock & Price |
DESCRIPTION
: The DPS128X32CV3/DPS128X32BV3 ‘’VERSA-STACK’’ module is a revolutionary new high speed memory subsystem using Dense-Pac Microsystems’ ceramic Stackable Leadless Chip Carriers (SLCC) mounted on a co-fired ceramic substrate. It offers 4 Megabits of SRAM in a package envelope of 1.090 x 1.090 x 0.252 inches. The DPS128X32CV3/DPS128X32BV3 contains four individual 128K x 8 SRAMs, packaged in their own hermetically sealed SLCCs making the module suitable for commercial, industrial and military applications. By using SLCCs, the ‘’Versa-Stack’’ family of modules offers a higher board density of memory than available with conventional through-hole, surface mount, module, or hybrid techniques. The DPS128X32BV3 has one active low Chip Enable (CE) and whileFEATURES
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● PIN-OUT DIAGRAM w .D * Commercial only. PIN NAMES at A0 - A16 I/O0 - I/O31 CE0 - CE3 SEL WE0 - WE1 OE VDD VSS N.C. aS he Address Inputs Data Input/Output Low Chip Enables High Chip Enable Write Enables Output Enable Power (+5V) Ground No Connect 30A044-24 REV.
