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DPS128X32BV3 - 128kx32 High Speed CMOS SRAM

Download the DPS128X32BV3 datasheet PDF. This datasheet also covers the DPS128X32CV3_Dense variant, as both devices belong to the same 128kx32 high speed cmos sram family and are provided as variant models within a single manufacturer datasheet.

General Description

The DPS128X32CV3/DPS128X32BV3 ‘’VERSA-STACK’’ module is a revolutionary new high speed memory subsystem using Dense-Pac Microsystems’ ceramic Stackable Leadless Chip Carriers (SLCC) mounted on a co-fired ceramic substrate.

Key Features

  • w.
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  • PIN-OUT.

📥 Download Datasheet

Note: The manufacturer provides a single datasheet file (DPS128X32CV3_Dense-PacMicrosystems.pdf) that lists specifications for multiple related part numbers.

Datasheet Details

Part number DPS128X32BV3
Manufacturer Dense-Pac Microsystems
File Size 488.67 KB
Description 128kx32 High Speed CMOS SRAM
Datasheet download datasheet DPS128X32BV3 Datasheet

Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

View original datasheet text
4 Megabit High Speed CMOS SRAM DPS128X32CV3/DPS128X32BV3 DESCRIPTION: The DPS128X32CV3/DPS128X32BV3 ‘’VERSA-STACK’’ module is a revolutionary new high speed memory subsystem using Dense-Pac Microsystems’ ceramic Stackable Leadless Chip Carriers (SLCC) mounted on a co-fired ceramic substrate. It offers 4 Megabits of SRAM in a package envelope of 1.090 x 1.090 x 0.252 inches. The DPS128X32CV3/DPS128X32BV3 contains four individual 128K x 8 SRAMs, packaged in their own hermetically sealed SLCCs making the module suitable for commercial, industrial and military applications. By using SLCCs, the ‘’Versa-Stack’’ family of modules offers a higher board density of memory than available with conventional through-hole, surface mount, module, or hybrid techniques.