Datasheet Details
| Part number | DPS128X32BV3 |
|---|---|
| Manufacturer | Dense-Pac Microsystems |
| File Size | 488.67 KB |
| Description | 128kx32 High Speed CMOS SRAM |
| Datasheet | DPS128X32BV3 DPS128X32CV3_Dense Datasheet (PDF) |
|
|
|
Overview: 4 Megabit High Speed CMOS SRAM DPS128X32CV3/DPS128X32BV3.
This datasheet includes multiple variants, all published together in a single manufacturer document.
| Part number | DPS128X32BV3 |
|---|---|
| Manufacturer | Dense-Pac Microsystems |
| File Size | 488.67 KB |
| Description | 128kx32 High Speed CMOS SRAM |
| Datasheet | DPS128X32BV3 DPS128X32CV3_Dense Datasheet (PDF) |
|
|
|
: The DPS128X32CV3/DPS128X32BV3 ‘’VERSA-STACK’’ module is a revolutionary new high speed memory subsystem using Dense-Pac Microsystems’ ceramic Stackable Leadless Chip Carriers (SLCC) mounted on a co-fired ceramic substrate.
It offers 4 Megabits of SRAM in a package envelope of 1.090 x 1.090 x 0.252 inches.
The DPS128X32CV3/DPS128X32BV3 contains four individual 128K x 8 SRAMs, packaged in their own hermetically sealed SLCCs making the module suitable for mercial, industrial and military applications.
| Part Number | Description |
|---|---|
| DPS128X32CV3 | 128kx32 High Speed CMOS SRAM |
| DPS128C32BV3 | 512kx8 High Speed CMOS SRAM |
| DPS128M8 | 128kx8 High Speed CMOS SRAM |
| DPS128M8xxx | 128kx8 High Speed CMOS SRAM |