DPS128X32BV3 Description
The DPS128X32CV3/DPS128X32BV3 ‘’VERSA-STACK’’ module is a revolutionary new high speed memory subsystem using Dense-Pac Microsystems’ ceramic Stackable Leadless Chip Carriers (SLCC) mounted on a co-fired ceramic substrate. It offers 4 Megabits of SRAM in a package envelope of 1.090 x 1.090 x 0.252 inches. The DPS128X32CV3/DPS128X32BV3 contains four individual 128K x 8 SRAMs, packaged in their own hermetically sealed...
DPS128X32BV3 Key Features
- PIN-OUT DIAGRAM
- mercial only
- A16 I/O0
- I/O31 CE0
- CE3 SEL WE0
- WE1 OE VDD VSS N.C
- No clock or refresh required Low Power Dissipation: 8.0mW (typ.) Full Standby 0.8W (typ.) Operating (x8) Single +5V Powe