Diotec Semiconductor ADB2508
25 AMP SILICON BRIDGE RECTIFIERS
FEATURES
MECHANICAL SPECIFICATION SERIES: DB2500 - DB2510 and ADB2504 - ADB2508 VOID FREE VACUUM DIE SOLDERING FOR MAXIMUM MECHANICAL STRENGTH AND HEAT DISSIPATION (Solder Voids: Typical < 2%, Max. < 10% of Die Area) BUILT-IN STRESS RELIEF MECHANISM FOR SUPERIOR RELIABILITY AND PERFORMANCE MAXIMUM BH XDYa` bUcadBbfeUY¥g hfiqpsr3t@u v0Yfexw y c Ya` u bUc c s eUiqc ba` Yv BH LT LL ELECTRICALLY ISOLATED METAL CASE FOR HEAT DISSIPATION D1 HOLE FOR #8 SCREW LD UL RECOGNIZED - FILE #E124962 RoHS COMPLIANTMECHANICAL DATA
D1 + Q&R G&H _ D3 BL BL D1 + E&F _ I&P D2 SUT D2 VUW _ + Case: Metal (Potting epoxy carries U/L flammability Rating 94V-0) Terminals: Round silver plated copper pins or fast-on terminals Soldering: Per MIL-STD 202 Method 208 guaranteed Polarity: Marked on side of case Mounting Position: Any. Through hole for #8 screw. Max. mounting torque = 20 in-lb. Weight: Fast-on Terminals - 1.1 Ounces (31.6 Grams) Wire Leads - 0.95 Ounce (28.5 Grams) SYM BL BH D1 D2 D3 LT BL MIL...