Diotec Semiconductor ADB2508P
25 AMP SILICON BRIDGE RECTIFIERS
FEATURES
MECHANICAL SPECIFICATION SERIES: DB2500P - DB2510P and ADB2504P - ADB2508P VOID FREE VACUUM DIE SOLDERING FOR MAXIMUM MECHANICAL STRENGTH AND HEAT DISSIPATION (Solder Voids: Typical < 2%, Max. < 10% of Die Area) BUILT-IN STRESS RELIEF MECHANISM FOR SUPERIOR RELIABILITY AND PERFORMANCE INTEGRALLY MOLDED HEAT SINK PROVIDES VERY LOW THERMAL RESISTANCE FOR MAXIMUM HEAT DISSIPATION Heat Sink BH Heat Sink BH Molded Body LT LL Molded Body LD D1 HOLE FOR #8 SCREW HOLE FOR #8 SCREW UL RECOGNIZED - FILE #E124962 + AC D3 BL )+ )+ + _ RoHS COMPLIANTMECHANICAL DATA
AC BL D1 + D1 AC D2 _ _ AC D1 BL D2 Case: Case: Molded epoxy with integral heat sink Epoxy carries a U/L Flammability rating of 94V-0 Terminals: Round silver plated copper pins or fast-on terminals Soldering: Per MIL-STD 202 Method 208 guaranteed Polarity: Marked on side of case Mounting Position: Any. Through hole for #8 screw. Max. mounting torque = 20 in-lb. Weight: Fast-on Terminals - 0.7 Ounces (20.0 Grams) Wire Leads - 0.