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FMN2ET2SCD-25IH - 1.8V NAND Flash Memory and Mobile DDR2

Download the FMN2ET2SCD-25IH datasheet PDF. This datasheet also covers the FMN2ST2SCD-25IH variant, as both devices belong to the same 1.8v nand flash memory and mobile ddr2 family and are provided as variant models within a single manufacturer datasheet.

Key Features

  • Operating Temperature Range - Industrial Part : - 40°C ~ 85°C.
  • NAND.
  • Architecture (2G bits) - Input / Output Bus Width: 8-bits / 16-bits - Page size X 8 : (2K+64spare) bytes (@1.8V) X16 : (1K+32spare) words (@1.8V).
  • Block size X8 : (128K+4K) bytes X16 : (64K+2K) words.
  • Plane Size: 1024 Blocks.
  • Device Size: 2 Planes per Device.
  • Page Read / Program - Random Read Time (tR): 25 μs (Max) - Sequential Access Time: 45 ns (Min) - Page Program:.

📥 Download Datasheet

Note: The manufacturer provides a single datasheet file (FMN2ST2SCD-25IH-Dosilicon.pdf) that lists specifications for multiple related part numbers.

Datasheet Details

Part number FMN2ET2SCD-25IH
Manufacturer Dosilicon
File Size 6.95 MB
Description 1.8V NAND Flash Memory and Mobile DDR2
Datasheet download datasheet FMN2ET2SCD-25IH Datasheet

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FMN2ET2TCD-25IH 1.8V NAND Flash Memory and Mobile DDR2
FMN2ST2SCD-25IH 1.8V NAND Flash Memory and Mobile DDR2
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Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

View original datasheet text
FMN2xT2xCD-25Ix FMN2xT2xCD-25IH Datasheet • Do not leave this document unattended. • This information contained in this document covered by the non-discloser agreement. • Do not reproduce this document. • This document is property of Dosilicon Co., Ltd. and maybe be required to be returned at any time. Rev. 0.2 Mar. ‘20 Dosilicon Co., Ltd. 1 Document Title Stacked Multi-Chip Product (NAND=2Gb, LPDDR2=2Gb) Revision History Revision No. 0.0 Initial Draft 0.1 Revised IDD SPEC 0.2 Modify some formats History FMN2xT2xCD-25Ix Draft date Dec. 8th, 2016 Apr. 26th, 2017 Mar. 16th, 2020 Remark Preliminary Rev. 0.2 Mar. ‘20 2 Stacked Multi-Chip Product(MCP) 1.8V NAND Flash Memory and Mobile DDR2 1.