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FMN2ST2TCD-25IH Datasheet 1.8v Nand Flash Memory And Mobile Ddr2

Manufacturer: Dosilicon

Overview: FMN2xT2xCD-25Ix FMN2xT2xCD-25IH Datasheet • Do not leave this document unattended. • This information contained in this document covered by the non-discloser agreement. • Do not reproduce this document. • This document is property of Dosilicon Co., Ltd. and maybe be required to be returned at any time. Rev. 0.2 Mar. ‘20 Dosilicon Co., Ltd. 1 Document Title Stacked Multi-Chip Product (NAND=2Gb, LPDDR2=2Gb) Revision History Revision No. 0.0 Initial Draft 0.1 Revised IDD SPEC 0.2 Modify some formats History FMN2xT2xCD-25Ix Draft date Dec. 8th, 2016 Apr. 26th, 2017 Mar. 16th, 2020 Remark Preliminary Rev. 0.2 Mar. ‘20 2 Stacked Multi-Chip Product(MCP) 1.8V NAND Flash Memory and Mobile DDR2 1.

This datasheet includes multiple variants, all published together in a single manufacturer document.

Key Features

  • Operating Temperature Range - Industrial Part : - 40°C ~ 85°C.
  • NAND.
  • Architecture (2G bits) - Input / Output Bus Width: 8-bits / 16-bits - Page size X 8 : (2K+64spare) bytes (@1.8V) X16 : (1K+32spare) words (@1.8V).
  • Block size X8 : (128K+4K) bytes X16 : (64K+2K) words.
  • Plane Size: 1024 Blocks.
  • Device Size: 2 Planes per Device.
  • Page Read / Program - Random Read Time (tR): 25 μs (Max) - Sequential Access Time: 45 ns (Min) - Page Program:.

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