DIM200PKM33-F000 Datasheet | Dynex Semiconductor

FEATURES - - - 10µs Short Circuit Withstand Soft Punch Through Silicon Isolated Al Si C Base with Al N substrates High thermal cycling capability KEY PARAMETERS VCES VCE (sat)- (typ) IC (max) IC(PK) (max) - 3300V 2.8V 200A 400A - (measured at the power busbars and not the auxiliary terminals) APPLICATIONS - - - - Choppers Motor Controllers Power Supplies Traction Auxiliaries The Powerline range of high power modules includes half bridge, chopper, dual, single and bidirectional switch configurations covering voltages from 600V to 3300V and currents up to 2400A. The DIM200PKM33-F000 is a 3300V, n channel enhancement mode, insulated gate bipolar transistor (IGBT) chopper module configured with the upper arm of the bridge controlled. The IGBT has a wide reverse bias safe operating area (RBSOA) plus full 10µs short circuit withstand. This device is optimised for traction drives and other applications requiring high thermal cycling capability. The module incorporates an electrically isolated base plate and low inductance construction enabling circuit designers to optimise circuit layouts and utilise grounded heat sinks for safety. Fig. 1 Chopper circuit diagram ORDERING INFORMATION Order As: DIM200PKM33-F000 Note: When ordering, please use the whole part number. Outline type code: P (See package details for further information) Caution: This device is sensitive to electrostatic discharge. Users should follow ESD handling procedures. 1/10 .dynexsemi. .. SEMICONDUCTOR Fig. 2 Electrical connections (not to scale) Caution: This device is sensitive to electrostatic discharge. Users should follow ESD handling procedures 2/10 .dynexsemi. .. SEMICONDUCTOR ABSOLUTE MAXIMUM RATINGS - PER ARM Stresses above those listed under ‘Absolute Maximum Ratings’ may cause permanent damage to the device. In extreme conditions, as with all semiconductors, this may include potentially hazardous rupture of the package. Appropriate safety...