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DIM300XCM45-F000 - IGBT Chopper Module

Features

  • Soft Punch Through Silicon Isolated AlSiC Base with AlN Substrates High Thermal Cycling Capability 10µs Short Circuit Withstand Lead Free construction 10.2kV isolation KEY.

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Datasheet preview – DIM300XCM45-F000

Datasheet Details

Part number DIM300XCM45-F000
Manufacturer Dynex Semiconductor
File Size 316.09 KB
Description IGBT Chopper Module
Datasheet download datasheet DIM300XCM45-F000 Datasheet
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www.DataSheet4U.com DIM300XCM45-F000 IGBT Chopper Module DS5918- 1.3 February 2009(LN26586) FEATURES Soft Punch Through Silicon Isolated AlSiC Base with AlN Substrates High Thermal Cycling Capability 10µs Short Circuit Withstand Lead Free construction 10.2kV isolation KEY PARAMETERS V CES V CE(sat) * (typ) IC (max) I C(PK) (max) *(measured at the auxiliary terminals) 4500V 2.9V 300A 600A APPLICATIONS High Reliability Inverters Motor Controllers Traction Drives Choppers The Powerline range of high power modules includes half bridge, chopper, dual, single and bi-directional switch configurations covering voltages from 1200V to 6500V and currents up to 3600A.
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