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3216TD - Time-delay Chip surface mount fuse

Datasheet Summary

Features

  • Time-delay, surface mount fuse.
  • RoHS compliant, lead-free and halogen-free.
  • High inrush withstand capability.
  • Wire-in-Air performance.
  • Compatible with leaded and lead-free reflow and wave solder Agency information.
  • cURus Recognition File number: E19180 Environmental data.
  • Operating temperature range: -55 °C to +125 °C with proper derating.
  • Vibration: MIL-STD-202, Method 204 Condition D.
  • Solderability: ANSI/J-STD-0.

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Datasheet Details

Part number 3216TD
Manufacturer EATON
File Size 454.39 KB
Description Time-delay Chip surface mount fuse
Datasheet download datasheet 3216TD Datasheet
Additional preview pages of the 3216TD datasheet.

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Full PDF Text Transcription

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Technical Data 4321 Effective May 2017 Supersedes March 2010 3216TD Time-delay Chip™ surface mount fuse HALOGEN HF FREE Pb Product features • Time-delay, surface mount fuse • RoHS compliant, lead-free and halogen-free • High inrush withstand capability • Wire-in-Air performance • Compatible with leaded and lead-free reflow and wave solder Agency information • cURus Recognition File number: E19180 Environmental data • Operating temperature range: -55 °C to +125 °C with proper derating • Vibration: MIL-STD-202, Method 204 Condition D • Solderability: ANSI/J-STD-002C, Test B Soldering method • Wave immersion: 260°C, 10 Sec. max. • Infrared reflow: 260°C, 30 Sec. max. • Hand solder: 350°C, 3 Sec. max. Ordering • Specify packaging and product code (i.e.
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