BY584 Datasheet | EIC Semiconductor

FEATURES : - Glass passivated junction chip - High current capability - High surge current capability - High reliability - Low reverse current - Low forward voltage drop - Fast switching for high efficiency - Pb / Ro HS Free MECHANICAL DATA : - Case : DO-41 Molded plastic - Epoxy : UL94V-O rate flame retardant - Lead : Axial lead solderable per MIL-STD-202, Method 208 guaranteed - Polarity : Color band denotes cathode end - Mounting position : Any - Weight : 0.339 gram - 41 0.108 (2.74) 0.079 (1.99) 0.034 (0.86) 0.028 (0.71) 1.00 (25.4) MIN. 0.205 (5.20) 0.166 (4.20) 1.00 (25.4) MIN. Dimensions in inches and ( millimeters ) MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS Rating at 25 °C ambient temperature unless otherwise specified. Single phase, half wave, 60 Hz, resistive or inductive load. For capacitive load, derate current by 20%. RATING Maximum Repetitive Peak Reverse Voltage Maximum Working Reverse Voltage Maximum Non-Repetitive Peak Reverse Voltage Maximum Average Forward Current (Note 1) Maximum Non-Repetitive Peak Forward Surge Current Maximum Repetitive Peak Forward Current Maximum Forward Voltage at 100 m A , Tj=Tj max. Maximum Reverse Current at Reverse Voltage Maximum Reverse Recovery Time (Note 2) Diode Capacitance (VR = 0 V; f = 1 MHz) Thermal Resistance - Junction to Ambient Junction Temperature Range Storage Temperature Range Notes : (1) Ttp = 25 °C, Lead Length 10 mm. (2) Measured with IF = 100 m A, to VR ≥ 100V SYMBOL VRRM VRW VRSM IF(AV) IFSM IFRM VF IR Trr Cd RӨJA TJ TSTG VALUE 1800 1500 1800 85 5.0 800 8.5 3.0 0.2 2...