• Part: BY584
  • Manufacturer: New Jersey Semiconductor
  • Size: 75.45 KB
Download BY584 Datasheet PDF
BY584 page 2
Page 2

BY584 Description

Rugged glass package, using a high temperature alloyed construction. This package is hermetically sealed and fatigue free as coefficients of expansion of all used parts are matched. The package is designed to be used in an insulating medium such as resin, oil or SF6 gas.

BY584 Key Features

  • Glass passivated
  • High maximum operating
  • Low leakage current
  • Excellent stability
  • Soft-recovery switching
  • pact construction

BY584 Applications

  • Grid 2 supply in colour television
  • High-voltage applications for