SMBJ5335B Datasheet | EIC Semiconductor

FEATURES : - High peak reverse power dissipation - High reliability - Low leakage current - Pb / Ro HS Free MECHANICAL DATA - Case : SMB Molded plastic - Epoxy : UL94V-0 rate flame retardant - Lead : Lead Formed for Surface Mount - Polarity : Color band denotes cathode end - Mounting position : Any - Weight : 0.108 gram SMB (DO-214AA) 1.14 ± 0.38 0.203 MAX 5.4 ± 0.19 4.315 ± 0.255 2.0 ± 0.20 3.62 ± 0.32 2.28 ± 0.15 0.228 ± 0.07 Dimensions in millimeters MAXIMUM RATINGS Rating at 25 °C ambient temperature unless otherwise specified Rating Power Dissipation at TL = 75 °C Maximum Forward Voltage at IF = 200 m A Thermal Resistance, Junction to Ambient (Note 1) Thermal Resistance, Junction to Lead (Note 1) Thermal Resistance, Junction to Case Operating and Storage Temperature Range Symbol PD VF RӨJA RӨJL RӨJC TJ, TSTG Note : (1) When mounted on FR4 PC board (1 oz Cu) with remended footprint. Value 5 1.2 90 25 40 - 65 to + 150 Unit W V °C/W °C/W °C/W °C Fig. 1 POWER DERATING CURVE PD, MAXIMUM DISSIPATION (WATTS) Page 1 of 2 TL, LEAD TEMPERATURE (°C) Rev. 11 : Nov 10, 2020 .eicsemi. ELECTRICAL CHARACTERISTICS (Rating at 25 °C ambient temperature unless otherwise specified) Regulator...