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EPC2112 – 200 V, 10 A Integrated Gate Driver eGaN® IC Preliminary Datasheet
FEATURES:
• Integrated Gate Driver – Low Propagation Delay – Up to 7 MHz Operation – Operates from 5 V Supply
• 200 V, 40-mΩ eGaN FET • Low Inductance 2.9 mm x 1.1 mm BGA
EPC2112 devices are supplied only in passivated die form with solder balls
Die Size: 2.9 mm x 1.1 mm
APPLICATIONS: • Wireless Power (Highly Resonant and Inductive) • High Frequency DC-DC Conversion
Schematic Diagram
DESCRIPTION The EPC2112 enhancement-mode gallium-nitride (eGaN®) integrated driver and FET consists of a 40-mΩ, 200 V eGaN power transistor and an optimized gate driver in a low inductance 2.9 mm by 1.1 mm surfacemount BGA.