• Part: M15T1G1664A-EFBG2S
  • Description: 8M x 16 Bit x 8 Banks DDR3 SDRAM
  • Manufacturer: Elite Semiconductor Microelectronics Technology
  • Size: 7.25 MB
Download M15T1G1664A-EFBG2S Datasheet PDF
Elite Semiconductor Microelectronics Technology
M15T1G1664A-EFBG2S
M15T1G1664A-EFBG2S is 8M x 16 Bit x 8 Banks DDR3 SDRAM manufactured by Elite Semiconductor Microelectronics Technology.
Feature - Interface and Power Supply ˗ SSTL_135: VDD/VDDQ = 1.35V(-0.067V/+0.1V) ˗ SSTL_15: VDD/VDDQ = 1.5V(±0.075V) - JEDEC DDR3(L) pliant ˗ 8n Prefetch Architecture ˗ Differential Clock (CK/ CK ) and Data Strobe (DQS/ DQS ) ˗ Double-data rate on DQs, DQS and DM - Data Integrity ˗ Auto Refresh and Self Refresh Modes - Power Saving Mode ˗ Partial Array Self Refresh(PASR) ˗ Power Down Mode - Signal Integrity ˗ Configurable DS for system patibility ˗ Configurable On-Die Termination ˗ ZQ Calibration for DS/ODT impedance accuracy via external ZQ pad (240 ohm ± 1%) M15T1G1664A (2S) 8M x 16 Bit x 8 Banks DDR3(L) SDRAM - Signal Synchronization ˗ Write Leveling via MR settings ˗ Read Leveling via MPR - Programmable Functions ˗ CAS Latency (6/7/8/9/10/11/12/13/14) ˗ CAS Write Latency (5/6/7/8/9/10) ˗ Additive Latency (0/CL-1/CL-2) ˗ Write Recovery Time (5/6/7/8/10/12/14/16) ˗ Burst Type (Sequential/Interleaved) ˗ Burst Length (BL8/BC4/BC4 or 8 on the fly) ˗ Self Refresh Temperature Range(Normal/Extended) ˗ Output Driver Impedance (34/40) ˗ On-Die Termination of RTT_Nom(20/30/40/60/120) ˗ On-Die Termination of RTT_WR(60/120) ˗ Precharge Power Down (slow/fast) Ordering Information Product ID Max Freq. Data Rate (CL-t RCD-t RP) M15T1G1664A- EFBG2S 1066MHz 1.35V / 1.5V DDR3(L)-2133 (14-14-14) M15T1G1664A- DEBG2S 933MHz 1.35V / 1.5V DDR3(L)-1866 (13-13-13) Package ments 96 ball BGA 96 ball BGA Pb-free Pb-free Elite Semiconductor Microelectronics Technology Inc Publication Date : Jan. 2022 Revision : 1.1 1/169 ESMT M15T1G1664A (2S) Description The 1Gb Double-Data-Rate-3 (DDR3(L)) DRAM is double data rate architecture to achieve high-speed operation. It is internally configured as an eight-bank DRAM. The 1Gb chip is organized as 8Mbit x 16 I/Os x 8 bank devices. These synchronous devices achieve high speed double-data-rate transfer rates of up to 2133 Mb/sec/pin for general applications. The chip is designed to ply with all key DDR3(L) DRAM key features and all...