WS512K32BV
Key Features
- 66-pin, PGA Type, 1.385 inch square Hermetic Ceramic HIP (Package 402)
- 68 lead, Hermetic CQFP (G2), 22mm (0.880 inch) square (Package 500). Designed to fit JEDEC 68 lead 0.990" CQFJ footprint s Organized as 512Kx32; User Configurable as 1Mx16 or 2Mx8 s Radiation Tolerant with Epitaxial Layer Die s s s s s Commercial, Industrial and Military Temperature Ranges 3.3 Volt Power Supply BiCMOS TTL Compatible Inputs and Outputs Built-in Decoupling Caps and Multiple Ground Pins for Low Noise Operation s Weight WS512K32BV-XG2XE - 8 grams typical WS512K32NBV-XH2XE - 13 grams typical
- This data sheet describes a product under development, not fully characterized, and is subject to change without notice. † This speed is Advanced information.
