HB52RF1289E2-75B Datasheet | Elpida Memory

Description The HB52RF1289E2 belongs to 8-byte DIMM (Dual In-line Memory Module) family, and has been developed as an optimized main memory solution for 8-byte processor applications. The HB52RF1289E2 is a 64M × 72 × 2-bank Synchronous Dynamic RAM Module, mounted 36 pieces of 256-Mbit SDRAM (HM5225405BTB) sealed in TCP package, 1 piece of PLL clock driver, 3 pieces register driver and 1 piece of serial EEPROM (2-kbit) for Presence Detect (PD). An outline of the HB52RF1289E2 is 168-pin socket type package (dual lead out). Therefore, the HB52RF1289E2 makes high density mounting possible without surface mount technology. The HB52RF1289E2 provides mon data inputs and outputs. Decoupling capacitors are mounted beside TCP on the module board. Note: Do not push the cover or drop the modules in order to protect from mechanical defects, which would be electrical defects. Features - Fully patible with : JEDEC standard outline 8-byte DIMM - 168-pin socket type package (dual lead out)  Outline: 133.37 mm (length) × 38.10 mm (Height) × 4.80 mm (Thickness)  Lead pitch: 1.27 mm - 3.3 V power supply - Clock frequency: 133 MHz (max) - LVTTL interface - Data bus width: × 72ECC - Single pulsed RAS - 4 Banks can operates simultaneously and independently - Burst read/write operation and burst read/single write operation capability - Programmable burst length: 1/2/4/8 - 2 variations of burst sequence Elpida Memory, Inc. is a joint venture DRAM pany of NEC Corporation and Hitachi, Ltd.  Sequential  Interleave - Programmable CE latency : 4 - Byte control by DQMB - Refresh cycles: 8192 refresh cycles/64 ms - 2 variations of refresh  Auto refresh  Self refresh Ordering Information Type No. Frequency CE latency Package Contact pad 133 MHz 4 Note: 1. 100 MHz operation at CE latency = 3. 168-pin dual lead out socket type Gold Pin Arrangement 1 pin 10 pin 11 pin 40 pin 41 pin 84 pin 85 pin 94 pin 95 pin 124 pin 125 pin 168 pin Data Sheet...