EN71SN10F Overview
Key Features
- Multi-Chip Package
- NAND Flash Density: 1-Gbits
- Mobile DDR SDRAM Density: 512-Mbit
- Device Packaging
- 107 balls FBGA Area: 10.5x13 mm; Height: 1.2 mm
| Part | EN71SN10F |
|---|---|
| Description | 1.8V NAND Flash + 1.8V Mobile DDR SDRAM Multi-Chip |
| Manufacturer | Elite Semiconductor Microelectronics Technology |
| Size | 4.04 MB |
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