EM74I08HVAGB-H Datasheet | Etron Technology

Features - Packaged NAND flash memory with e.MMC 5.1 interface - Backward patible with all prior e.MMC specification revisions - Operating Voltage Support: - VCC: (3.3V) 2.7V ~ 3.6V - VCCQ: (1.8V) 1.7V ~ 1.95V / (3.3V) 2.7V ~ 3.6V - Temperature: - Operating Temperature: TA = -25°C to +85°C - Storage without operation: -40°C to +85°C - pliant with e.MMC 5.1 JEDEC Standard Number JESD84-B51 - Embedded Multi-Media storage in a single Multi-Chip package - Package: 153-ball 11.5 x 13.0 x 0.95mm FBGA package Part Number EM74I08HVAGB-H Table 1-1. Product Information NAND Density 8 GB VCC 3.3V VCCQ 1.8V/3.3V Package FBGA Etron Technology, Inc. 6 Etron Tech 8GB e.MMC 5.1 1.2 e.MMC Specific Feature - JEDEC/e.MMC Standard version 5.1 patible (backward patible to e.MMC 4.5) - Supports a wide range of power supply voltage: 1.8 and 3.3V - Supports HS400 Mode - e.MMC production state awareness - e.MMC device health report - Supports mand Queue - Programmable bus width: 1/4/8 bits - Supports Boot operation in High Speed and DDR mode - Supports Boot mode and Alternative Boot mode - Replay Protection Memory Block (RPMB) - Enhanced Partition Attributes - High Priority Interrupt (HPI) - Background operations - Enhanced Reliable Write - Secure removal types - Enhance techniques: Sleep Notification in power off notification, data tagging, packed mands, discard, sanitize, RTC (real time clock) - LDPC ECC Engine - Support multiple parity size with 1KB based...