FDZ5047N Description
bining Fairchild’s 30V PowerTrench process with state of the art BGA packaging, the FDZ5047N minimizes both PCB space and RDS(ON). This BGA MOSFET embodies a breakthrough in packaging technology which enables the device to bine excellent thermal transfer characteristics, high current handling capability, ultra-low profile packaging, low gate charge, and low RDS(ON).
FDZ5047N Key Features
- 22 A, 30 V
- Occupies only 27.5 mm2 of PCB area: 1/5 of the area of a TO-220 package
- Ultra-thin package: less than 0.90 mm height when mounted to PCB
- Outstanding thermal transfer characteristics
- Ultra-low gate charge x RDS(ON) product