IRFS250A
FEATURES
Avalanche Rugged Technology Rugged Gate Oxide Technology Lower Input Capacitance Improved Gate Charge Extended Safe Operating Area Lower Leakage Current : 10 µA (Max.) @ VDS = 200V Low RDS(ON) : 0.071 Ω(Typ.)
Absolute Maximum Ratings
Symbol VDSS
IDM VGS EAS IAR EAR dv/dt
TJ , TSTG
Characteristic
Drain-to-Source Voltage
Continuous Drain Current (TC=25o C) Continuous Drain Current (TC=100o C)
Drain Current-Pulsed
O1
Gate-to-Source Voltage
Single Pulsed Avalanche Energy Avalanche Current Repetitive Avalanche Energy Peak Diode Recovery dv/dt Total Power Dissipation (TC=25 o C ) Linear Derating Factor
O2 O1 O1 O3
Operating Junction and
Storage Temperature Range
Maximum Lead Temp. for Soldering
Purposes, 1/8 “ from case for 5-seconds
BVDSS = 200 V RDS(on) = 0.085 Ω ID = 21.3 A
TO-3PF
1 2 3
1.Gate 2. Drain 3. Source
Value 200 21.3 13.5 130 +_ 30 605 21.3 9 5.0 90 0.72
- 55 to +150
Units V
A V m J A m J V/ns W W/o C o C
Thermal Resistance
Symbol...
