Download IRFS610A Datasheet PDF
Fairchild Semiconductor
IRFS610A
FEATURES Avalanche Rugged Technology Rugged Gate Oxide Technology Lower Input Capacitance Improved Gate Charge Extended Safe Operating Area Lower Leakage Current : 10 µA (Max.) @ VDS = 200V Low RDS(ON) : 1.169 Ω (Typ.) Absolute Maximum Ratings Symbol VDSS IDM VGS EAS IAR EAR dv/dt TJ , TSTG Characteristic Drain-to-Source Voltage Continuous Drain Current (TC=25 o C) Continuous Drain Current (TC=100 o C) Drain Current-Pulsed O1 Gate-to-Source Voltage Single Pulsed Avalanche Energy O2 Avalanche Current Repetitive Avalanche Energy Peak Diode Recovery dv/dt Total Power Dissipation (TC=25 o C) Linear Derating Factor O1 O1 O3 Operating Junction and Storage Temperature Range Maximum Lead Temp. for Soldering Purposes, 1/8 “ from case for 5-seconds BVDSS = 200 V RDS(on) = 1.5 Ω ID = 2.5 A TO-220F 1 2 3 1.Gate 2. Drain 3. Source Value 200 2.5 1.6 10 +_ 30 42 2.5 2.2 5.0 22 0.18 - 55 to +150 Units V A V m J A m J V/ns W W/o C o C Thermal Resistance Symbol Rθ...