Fairchild Semiconductor MMBD301
The carrier tape is made from a dissipative (carbon filled) polycarbonate resin. The cover tape is a m ultilayer film (Heat Activated Adhesive in na ture) primarily composed of polyester film, adhesive layer, sealant, and anti-static sprayed agent.ABSOLUTE MAXIMUM RATINGS
* Sym Tstg TJ Wiv PF TA = 25OC unless otherwise noted Parameter Storage Temperature Operating Junction Temperature Working Inverse Voltage Forward Power Dissipation @ TA = 25OC Derate above 25OC Value -55 to +150 -55 to +125 25 200 2.0 Units OC OC V mW Mw/OC *These ratings are limiting values above which the serviceability of any semiconductor device may be impairedELECTRICAL CHARACTERISTICS
SYM TA = 25OC unless otherwise noted CHARACTERISTICS MIN 30 MAX UNITS V IR TEST CONDITIONS = 10 uA 25 V 1.0 mA 10 mA 15 V 1.0 MHz BV Breakdown Voltage IR Reverse Leakage VF Forward Voltage CT Capacitance © 1997 Fairchild Semiconductor Corporation 200 450 600 1.5 nA mV mV pF VR = IF = IF = VR = f = DISCRETE POWER AND SIGNAL TECHNOLOGIES 0.019 (0.483) 0.015 (0.381) 3 0.098 (2.489) 0.083 (2.108) 3 CHARACTERS MAX 0.055 (1.397) 0.047 (1.194) 1 2 0.024 (0.810) 0.018 (0.457) 0.040 (1.016) 0.035 (0.889) 0.080 (2.032) 0.070 (1.778) 0.120 (3.048) 0.110 (2.794) LOW PROFILE (49) 0.041...