The RMPA2266 Power Amplifier Module (PAM) is Fairchild’s latest innovation in 50Ω matched, surface mount modules targeting UMTS/WCDMA/HSDPA +16dBm Pout applications.
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PRELIMINARY
RMPA2266 i-Lo™ WCDMA Band I Power Amplifier Module
April 2007
RMPA2266 i-Lo™
WCDMA Band I Power Amplifier Module
Features
■ 40% WCDMA efficiency at +28dBm Pout ■ 20% WCDMA efficiency (58mA total current) at ■ ■ ■ ■
tm
General Description
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The RMPA2266 Power Amplifier Module (PAM) is Fairchild’s latest innovation in 50Ω matched, surface mount modules targeting UMTS/WCDMA/HSDPA +16dBm Pout applications.