SFU9224 Datasheet | Fairchild Semiconductor

FEATURES Avalanche Rugged Technology Rugged Gate Oxide Technology Lower Input Capacitance Improved Gate Charge Extended Safe Operating Area Lower Leakage Current : 10 µA (Max.) @ VDS = -250V Lower RDS(ON) : 1.65 Ω (Typ.) SFR/U9224 BVDSS = -250 V RDS(on) = 2.4 Ω ID = -2.5 A D-PAK 2 1 3 I-PAK 1. Gate 2. Drain 3. Source Absolute Maximum Ratings Symbol VDSS ID IDM VGS EAS IAR EAR dv/dt PD Characteristic Drain-to-Source Voltage Continuous Drain Current (TC=25 C) Continuous Drain Current (TC=100 C) Drain Current-Pulsed Gate-to-Source Voltage Single Pulsed Avalanche Energy Avalanche Current Repetitive Avalanche Energy Peak Diode Recovery dv/dt o Total Power Dissipation (TA=25 C) - o o Value -250 -2.5 -1.5 1 O Units V A A V m J A m J V/ns W W W/ C o -10 + _ 30 156 -2.5 3.0 -4.8 2.5 30 0.24 - 55 to +150 O 1 O 1 O 3 O Total Power Dissipation (TC=25 C) Linear Derating Factor Operating Junction and Storage Temperature Range Maximum Lead Temp. for Soldering Purposes, 1/8 “ from case for 5-seconds o TJ , TSTG TL o Thermal Resistance Symbol RθJC RθJA RθJA Characteristic Junction-to-Case Junction-to-Ambient - Junction-to-Ambient Typ. ---Max. 4.17 50 110 o Units C/W - When mounted on the minimum pad size remended (PCB Mount). Rev. B ©1999 Fairchild Semiconductor Corporation SFR/U9224 Symbol BVDSS ∆BV/∆TJ VGS(th) IGSS IDSS RDS(on) gfs Ciss Coss Crss td(on) tr td(off) tf Qg Qgs Qgd Characteristic Drain-Source Breakdown Voltage Breakdown Voltage Temp. Coeff. Gate Threshold Voltage Gate-Source Leakage , Forward Gate-Source Leakage , Reverse Drain-to-Source Leakage Current Static Drain-Source On-State Resistance Forward Transconductance Input Capacitance Output Capacitance Reverse Transfer Capacitance Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time Total Gate Charge Gate-Source Charge Gate-Drain( “ Miller “ ) Charge Min. Typ. Max. Units -250 --2.0 ------------------0.22 ------1.9 415 65 24 11 19 34 15 16 3.3 7.8 ---4.0 -100 100 -10 -100 2.4...