1SS355 Datasheet | Formosa MS

Features - Small surface mounting type - High speed - High reliability with high surge current handling capability - We declare that the material of product pliance with Ro HS requirements - Silicon epitaxial planar chip, metal silicon junction - Lead-free parts meet Ro HS requirements - Suffix "-H" for Halogen-free part, ex. 1SS355-H 0.053(1.35) 0.045(1.15) Package Outline SOD-323F 0.071(1.80) 0.063(1.60) 0.016(0.40) 0.010(0.25) Mechanical data - Epoxy:UL94-V0 rated flame retardant - Case : Molded plastic, SOD-323F - Terminals : Solder plated, solderable per MIL-STD-750, Method 2026 - Polarity : Indicated by cathode band - Mounting Position : Any - Weight : Approximated 0.005 gram 0.006(0.15) 0.004(0.10) 0.044(1.10) 0.035(0.90) 0.110(2.80) 0.091(2.30) Dimensions in inches and (millimeters) Maximum ratings (AT TA=25o C unless otherwise noted) Parameter Peak reverse voltage DC reverse voltage Peak forward current Mean rectifying current Surge current (1s) Operating junction temperature range Storage temperature range Symbol VRM VR IFM IO Isurge TJ TSTG Electrical characteristics (AT TA=25o C unless otherwise noted) Parameter Forward voltage(IF=100m Adc) Symbol VF Reverse voltage leakage current(VR=80Vdc) Diode capacitance(VR=0.5V, f=1.0MHz) Reverse recover time(VR=6V, IF=10m A, RL=100Ω) trr Thermal characteristics Parameter Total device dissipation FR-5 Board- 1, TA =...