MD8IC970GNR1
Key Features
- On--Chip Prematching. On--Chip Stabilization
- Integrated Quiescent Current Temperature pensation with Enable/Disable Function (1)
- Integrated ESD Protection
- 225°C Capable Plastic Package
- Functional Figure
- Characteristic Final Application Table
- Moisture Sensitivity Level Test Methodology Per JESD22--A113, IPC/JEDEC J--STD--020 Rating 3 Package Peak Temperature 260 Unit °C Table
