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MB84VP24491HK-70 - 128M (X16) FLASH MEMORY 32M (X16) Mobile FCRAMTM

General Description

Pin name A20 to A0 A21 DQ15 to DQ0 CE0f CE1f CE1r CE2r OE WE RY/BY UB LB RESET WP/ACC N.C.

Power Power Power Address Inputs (Common) Address Input (Flash) Data Inputs/Outputs (Common) Chip Enable (Flash) Chip Enable (Flash) Chip Ena

Key Features

  • Power Supply Voltage of 2.7 V to 3.1 V.
  • High Performance 20 ns maximum page read access time, 70 ns maximum random access time (Flash) 20 ns maximum page read access time, 70 ns maximum random access time (FCRAM).
  • Operating Temperature.
  • 30 °C to +85 °C.
  • Package 73-ball FBGA (Continued) s.

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Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

View original datasheet text
www.DataSheet4U.com SPANSION MCP Data Sheet TM September 2003 TM This document specifies SPANSION memory products that are now offered by both Advanced Micro Devices and Fujitsu. Although the document is marked with the name of the company that originally developed the specification, these products will be offered to customers of both AMD and Fujitsu. Continuity of Specifications There is no change to this datasheet as a result of offering the device as a SPANSION revisions will occur when appropriate, and changes will be noted in a revision summary. TM product. Future routine Continuity of Ordering Part Numbers AMD and Fujitsu continue to support existing part numbers beginning with "Am" and "MBM".