FP5ZC11
Overview
- Toal power dissipation:max,500mW
- Low leakage current
- Moisture sensitivity: level 1, per J-STD-020
- Solder dip 260 °C, 10 s
- Low profile， typical thickness 1.0mm
- For use in stabilizing and clipping circuits with high power rating eSGA (SOD‐123FL)
