MUR860
Key Features
- FRED (Planar) wafer construction
- Ultrafast recovery time
- Low forward voltage drop, low power loss
- High efficiency
- Plastic package has underwriters Laboratory
- Case: Epoxy, molded
- Weight: 1.9grams (approximately)
- Finish: all external surfaces corrosion resistant and terminal leads readily solderable
- Lead yemperature for soldering purposes: 260°C Max. for 10 sec
- 50 units per plastic tube
