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MUR860F Key Features

  • FRED (Planar) wafer construction
  • Ultrafast recovery time
  • Low forward voltage drop, low power loss
  • High efficiency
  • Plastic package has underwriters Laboratory
  • Case: Epoxy, molded
  • Weight: 1.9grams (approximately)
  • Finish: all external surfaces corrosion resistant and terminal leads readily solderable
  • Lead yemperature for soldering purposes: 260°C Max. for 10 sec
  • 50 units per plastic tube

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MUR860F Description

Features FRED (Planar) wafer construction Ultrafast recovery time Low forward voltage drop, low power loss High efficiency Plastic package has underwriters Laboratory Flammability Classification 94V-0 MUR860/MUR860F Ultrafast Recovery Rectifiers Reverse Voltage 600V Forward Current 8.0 A MUR860 Package: TO-220-AC MUR860F Package: 1.9grams (approximately) Finish:.