BYW29-100 Datasheet | General Semiconductor

FEATURES - Plastic package has Underwriters Laboratory Flammability Classification 94V-0 - Glass passivated chip junction - Low power loss - Low leakage current - High surge current capability - Superfast recovery time for high efficiency - High temperature soldering guaranteed: 250°C, 0.16” (4.06mm) from case for 10 seconds 0.113 (2.87) 0.103 (2.62) 0.145 (3.68) 0.135 (3.43) 0.560 (14 0.530 (13. 0.410 (10.41) 0.390 (9.91) PIN 1 0.160 (4.06) 0.140 (3.56) 0.560 (14.22) 0.530 (13.46) 2 0.635 (16.13) 0.625 (15.87) 0.350 (8.89) 0.330 (8.38) 1.148 (29.16) 1.118 (28.40) 0.110 (2.79) 0.100 (2.54) MECHANICAL DATA Case: JEDEC TO-220AC molded plastic body over passivated chip Terminals: Plated lead solderable per MIL-STD-750, Method 2026 Polarity: As marked Mounting Position: Any Weight: 0.064 ounce, 1.81 grams 0.105 (2.67) 0.095 (2.41) 0.037 (0.94) 0.027 (0.68) 0.022 (0.56) 0.014 (0.36) PIN 1 0.205 (5.20) 0.195 (4.95) PIN 2 CASE Dimensions in inches and (millimeters) MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS Ratings at 25°C ambient temperature unless otherwise specified. SYMBOLS BYW29-50 BYW29-150 BYW29-200 UNITS Maximum repetitive peak reverse voltage Maximum RMS voltage Maximum DC blocking voltage Maximum average forward rectified current at TC=125°C Peak forward surge current 10ms single half sine-wave superimposed at TJ=150°C Maximum instantaneous forward voltage at:IF=20A, TJ=25°C IF=8A, TJ=150°C Maximum DC reverse current at rated DC blocking voltage Maximum reverse recovery time (NOTE 1) Typical junction capacitance (NOTE 2) Maximum thermal resistance (NOTE 3) (NOTE 4) VRRM VRMS VDC I(AV) IFSM VF IR trr CJ RΘJA RΘJC TJ, TSTG 50 35 50 100 70 100 8.0 100.0 1.3 0.8 150 105 150 200 140 200 Volts Volts Volts Amps Amps Volts µA ns p F °C/W °C TC=25°C TC=100°C 10.0 500.0 25.0 45.0 20.0 3.0 -65 to +150 Operating and storage temperature range NOTES: (1) Reverse recovery test conditions: IF=1A, VR=30V, di/dt=100A/µs, Irr=10%, IRM for...