BYW29-100 Datasheet | Vishay

Features - Power pack - Glass passivated pellet chip junction - Ultrafast recovery time - Low switching losses, high efficiency - Low forward voltage drop - High forward surge capability - Meets MSL level 1, per J-STD-020, LF maximum peak of 245 °C (for TO-263AB package) - Solder dip 275 °C max. 10 s, per JESD 22-B106 (for TO-220AC and ITO-220AC package) - AEC-Q101 qualified - Material categorization: for definitions of pliance please see .vishay./doc?99912 TYPICAL APPLICATIONS For use in high frequency rectifier of switching mode power supplies, inverters, freewheeling diodes, DC/DC converters, and other power switching application. PRIMARY CHARACTERISTICS IF(AV) VRRM IFSM 8.0 A 50 V to 200 V 100 A...