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S0603F1 Datasheet PDF

Good-Ark Semiconductor S0603F1

Fast Acting Chip Fuse

Part No. S0603F1
Datasheet S0603F1 Download
Manufacturer
Good-Ark Semiconductor
Description Fast Acting Chip Fuse
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S0603F1 datasheet page 1 preview

DESCRIPTION

● Fast acting for excessive current
● Compatible with reflow and wave solder
● Rugged ceramic and glass construction
● Excellent environmental performance
● RoHS Compliant, Lead Free & Halogen Free material

APPLICATIONS

● Telecommunication: PDA / DSL/ Cell Phones
● Computers: LCD Panels / Printers/ Laptops/ Servers
● Consumer Electronics: DVD players/ MP3 and MP4 Players Sn PLATING CERAMIC SUBSTRATE OVERCOAT FUSE ELEMENT Ag / Ni PLATING Case: 0603 Environmental Data
● Life Test: MIL-STD-202, Method 108A
● Humidity Bias: MIL-STD-202, Method 103
● Moisture Resistance Test: MIL-STD-202, Method 106G
● Thermal Shock: MIL-STD-202, Method 107G
● Terminal Strength: AEC-Q200-006
● Board Flex: AEC-Q200-005 Appendix 2 Note: 1mm (Min)
● Vibration: MIL-STD-202, Method 204D
● Mechanical Shock: MIL-STD-202, Method 213B
● Solderability: MIL-STD-202 Method 208H
● Resistance to Solder Heat: MIL-STD-202, Method 210A

ELECTRICAL CHARACTERISTICS

Ampere Rating 250mA-6A 250mA-6A % of Amp Rating 10...
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