HY19P03P Description
TO-263-2L Date Code YYXXX WW Assembly Material G:lead Free Device Note: H8$<, lead-free products contain molding pounds/die attach materials and 100% matte tin plate TermiNation finish;which are fully pliant with RoHS. +8$<, lead-free products meet or exceed the lead-Free requirements of IPC/JEDEC J-STD-020 for MSL classification at lead-free peak reflow temperature.