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HSME-T600 - Surface Mount LED Indicator

Download the HSME-T600 datasheet PDF. This datasheet also covers the HSMD-T400 variant, as both devices belong to the same surface mount led indicator family and are provided as variant models within a single manufacturer datasheet.

General Description

These solid state surface mount indicators are designed with a flat top and sides to be easily handled by automatic placement equipment.

A glue pad is provided for adhesive mounting processes.

Key Features

  • Compatible with Automatic Placement Equipment.
  • Compatible with Infrared and Vapor Phase Reflow Solder Processes.
  • Packaged in 12 mm or 8 mm tape on 7" or 13" Diameter Reels.
  • EIA Standard Package.
  • Low Package Profile.
  • Nondiffused Package Excellent for Backlighting and Coupling to Light Pipes.

📥 Download Datasheet

Note: The manufacturer provides a single datasheet file (HSMD-T400-HP.pdf) that lists specifications for multiple related part numbers.

Datasheet Details

Part number HSME-T600
Manufacturer HP
File Size 195.18 KB
Description Surface Mount LED Indicator
Datasheet download datasheet HSME-T600 Datasheet

Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

View original datasheet text
H Surface Mount LED Indicator Technical Data HSMD-TX00 HSME-TX00 HSMG-TX00 HSMH-TX00 HSMS-TX00 HSMY-TX00 Features • Compatible with Automatic Placement Equipment • Compatible with Infrared and Vapor Phase Reflow Solder Processes • Packaged in 12 mm or 8 mm tape on 7" or 13" Diameter Reels • EIA Standard Package • Low Package Profile • Nondiffused Package Excellent for Backlighting and Coupling to Light Pipes Description These solid state surface mount indicators are designed with a flat top and sides to be easily handled by automatic placement equipment. A glue pad is provided for adhesive mounting processes. They are compatible with convective IR and vapor phase reflow soldering and conductive epoxy attachment processes.