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S5870 - Multi-element photodiodes

Key Features

  • Large active area www. DataSheet4U. com S5980: 5 × 5 mm S5981: 10 × 10 mm S5870: 10 × 10 mm l Chip carrier package suitable for surface mounting Facilitates automated surface mounting by solder reflow l Thin package: 1.26 mmt l Photo sensitivity: 0.72 A/W (λ=960 nm) s General ratings Parameter Symbol Window material G ap bet ween ele me nts Active area A S5980.

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Datasheet Details

Part number S5870
Manufacturer Hamamatsu Corporation
File Size 154.27 KB
Description Multi-element photodiodes
Datasheet download datasheet S5870 Datasheet

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Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

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PHOTODIODE Si PIN photodiode S5980, S5981, S5870 Multi-element photodiodes for surface mounting Features Large active area www.DataSheet4U.com S5980: 5 × 5 mm S5981: 10 × 10 mm S5870: 10 × 10 mm l Chip carrier package suitable for surface mounting Facilitates automated surface mounting by solder reflow l Thin package: 1.26 mmt l Photo sensitivity: 0.72 A/W (λ=960 nm) s General ratings Parameter Symbol Window material G ap bet ween ele me nts Active area A S5980 Applications l l Laser beam axis alignment l Level meters l Pointing devices, etc. φ5.0/4 elements S5981 Resin coating 30 φ10.0/4 elements S5870 φ10.0/2 elements Unit µm mm s Absolute maximum ratings Parameter Symbol Reverse voltage VR Max.