S5870 Datasheet | Hamamatsu Corporation

Features Large active area .. S5980: 5 × 5 mm S5981: 10 × 10 mm S5870: 10 × 10 mm l Chip carrier package suitable for surface mounting Facilitates automated surface mounting by solder reflow l Thin package: 1.26 mmt l Photo sensitivity: 0.72 A/W (λ=960 nm) s General ratings Parameter Symbol Window material G ap bet ween ele me nts Active area A S5980 Applications l l Laser beam axis alignment l Level meters l Pointing devices, etc. φ5.0/4 elements S5981 Resin coating 30 φ10.0/4 elements φ10.0/2 elements Unit µm mm s Absolute maximum ratings Parameter Symbol Reverse voltage VR Max. O perating te mp erature Topr Storage temperature Tstg S5980 S5981 30 -40 to +100 -40 to +125 S5870 Unit V °C °C s Electrical and optical characteristics (Ta=25 °C, per 1 element) Parameter Symbol Condition Spectral response range λ Peak sensitivity 960 λp wavelength λ=λp Photo sensitivity S 0.72 Dark current ID VR=10 V 0.3 Te mperature coefficient of I D TCID 1.15 V R =10 V, R L =50 Ω, -3 d B Cut-off frequency fc 25 T er minal c apacita nce Ct VR=10 V, f=1 MHz 10 Noise equivalent po wer NEP VR=10 V, λ=λp 1.4 × 10 - 1 4 Note) S5980: For mass production, order unit is 100 pieces. S5981, S5870: For mass production, order unit is 50 pieces. S5980 Typ. Max. 320 to 1100 2 S5981 Typ. Max. 320 to 1100 960 0.72 0.6 1.15 20 35 1.9 × 10 - 1 4 4 S5870 Typ. Max. 320 to 1100 960 0.72 2 1.15 10 50 3.5 × 10 - 1 4 10 Unit nm nm A/W n A times/°C MHz p F W/Hz1/2 Precautions for use q The light input window of this product uses soft silicone resin. Avoid touching the window to keep it from grime and damage that can decrease sensitivity. External force applied to the resin surface may deform or cut off the wires, so do not touch the window to prevent such troubles. q Use rosin flux when soldering, to prevent the terminal lead corrosion. Reflow oven temperature should be at 260 °C maximum for 5 seconds maximum time under the conditions that no moisture absorption occurs. Reflow soldering...