HX3400 Description
Hxsemi lead-free products contain molding pounds/die attach materials and 100% matte tin plate termination finish; which are fully pliant with RoHS. Hxsemi lead-free products meet or exceed the lead-free requirements of IPC/JEDEC J-STD-020C for MSL classification at lead-free peak reflow temperature.
HX3400 Key Features
- Super High Dense Cell Design
- Reliable and Rugged
- Lead Free and Green Devices Available
HX3400 Applications
- Power Management in Notebook