Hi3518 Datasheet | Hisilicon

Hi3518 Hardware Design User Guide Issue Date 01 2013-06-30 Copyright © HiSilicon Technologies Co., Ltd. 2012-2013. All rights reserved. No part of this document may be reproduced or transmitted in any form or by any means without prior written consent of HiSilicon Technologies Co., Ltd. Trademarks and Permissions , , and other HiSilicon icons are trademarks of HiSilicon Technologies Co., Ltd. All other trademarks and trade names mentioned in this document are the property of their respective holders. Notice The purchased products, services and Features are stipulated by the contract made between HiSilicon and the customer. All or part of the products, services and Features described in this document may not be within the purchase scope or the usage scope. Unless otherwise specified in the contract, all statements, information, and remendations in this document are provided "AS IS" without warranties, guarantees or representations of any kind, either express or implied. The information in this document is subject to change without notice. Every effort has been made in the preparation of this document to ensure accuracy of the contents, but all statements, information, and remendations in this document do not constitute a warranty of any kind, express or implied. HiSilicon Technologies Co., Ltd. Address: Website: Email: Huawei Industrial Base Bantian, Longgang Shenzhen 518129 People's Republic of China http://.hisilicon. support@hisilicon. Hi3518 Hardware Design User Guide About This Document About This Document Purpose This document describes the design remendations for the schematic diagrams, printed circuit board (PCB), and board heat dissipation of the Hi3518. It also provides the hardware design methods of the Hi3518. Related...