2SK2788 Datasheet | Hitachi Semiconductor

Features - Low on-resistance R DS(on) = 0.12Ω typ (VGS = 10 V, I D = 1 A) - Low drive current - High speed switching - 4V gate drive devices. Outline UPAK 1. Gate 2. Drain 3. Source 4. Drain Absolute Maximum Ratings (Ta = 25°C) Item Drain to source voltage Gate to source voltage Drain current Drain peak current Symbol VDSS VGSS ID I D(pulse)- 2 1 Ratings 60 ±20 2 4 2 1 150 - 55 to +150 Unit V V A A A W °C °C Body to drain diode reverse drain current I DR Channel dissipation Channel temperature Storage temperature Pch- Tch Tstg Notes: 1. PW ≤ 10 µs, duty cycle ≤ 1 % 2. When using the alumina ceramic board (12.5 x 20 x 0.7 mm) Electrical Characteristics (Ta = 25°C) Item Drain to source breakdown voltage Gate to source breakdown voltage Zero gate voltege drain current Gate to source leak current Gate to source cutoff voltage Static drain to source on state resistance Forward transfer admittance Input capacitance Output capacitance Reverse transfer capacitance Turn-on delay time Rise time Turn-off delay time Fall time Body to drain diode forward voltage Body to drain diode reverse recovery time Notes: 1. Pulse test 2. Marking is “VY” Symbol V(BR)DSS V(BR)GSS I DSS I GSS VGS(off) RDS(on) RDS(on) |yfs| Ciss Coss Crss t d(on) tr t d(off) tf VDF t rr Min 60 ±20 - - 1.0 - - 1.6 - - - - - - - - - Typ - - - - - 0.12 0.16 2.8 180 90 30 9 15 40 35 0.9 35 Max - - 10 ±10 2.0 0.16 0.25 - - - - - - - - - - Unit V V µA µA V Ω Ω S p F p F p F ns ns ns ns V ns I D = 2A, VGS = 0 I F = 2A, VGS = 0 di F/ dt = 50A/µs Test Conditions I D = 10m A, VGS = 0 I G = ±100µA, VDS = 0 VDS = 60 V, VGS = 0 VGS = ±16V, VDS = 0 I D = 1m A, VDS = 10V I D = 1 A, VGS = 10V- 1 I D = 1A, VGS = 4V- 1 I D = 1A, VDS = 10V- 1 VDS = 10V VGS = 0 f = 1MHz VGS = 10V, ID = 1A RL = 30Ω Main Characteristics Power vs. Temperature Derating 2.0 Pch (W) I D (A) Test condition : When using the alumina ceramic board (12.5 x 20 x 0.7 mm) 10 100 µs 3 1 Maximum Safe Operation...