HB56SW3272ESK-5 Datasheet | Hitachi Semiconductor

Description The HB56SW3272ESK belong to 8-byte DIMM (Dual in-line Memory Module) family , and have been developed an optimized main memory solution for 4 and 8-byte processor applications. The HB56SW3272ESK is 32 M × 72 Dynamic RAM Module, mounted 36 pieces of 64-Mbit DRAM (HM5165405) sealed in TCP package and 2 pieces of 16-bit Bi CMOS line driver sealed in TSSOP package. The HB56SW3272ESK offer Extended Data Out (EDO) Page Mode as a high speed access mode. An outline of the HB56SW3272ESK are 168-pin socket type package (dual lead out). Therefore, the HB56SW3272ESK make high density mounting possible without surface mount technology. The HB56SW3272ESK provide mon data inputs and outputs. Decoupling capacitors are mounted beside each TCP on its module board. Note: Do not push the cover or drop the modules in order to protect from mechanical defects, which would be electrical defects. Features - 168-pin socket type package (Dual lead out)  Lead pitch : 1.27 mm - Single 3.3 V supply (±0.3 V) - High speed  Access time: t RAC = 50 ns/60 ns (max)  Access time: t CAC = 18 ns/20 ns (max) - Low power dissipation  Active mode: 8.78 W/7.49 W (max)  Standby mode (TTL): 295.2 m W (max) - JEDEC standard outline buffered 8-byte DIMM - Buffered input except RAS and DQ HB56SW3272ESK-5/6 - - - - 4-byte interleave enabled, dual address input (A0/B0) EDO page mode capability 4096 refresh cycles: 64 ms 2 variations of refresh  RAS -only refresh  CAS -before-RAS refresh Ordering Information Type No. HB56SW3272ESK-5 HB56SW3272ESK-6 Access time 50 ns 60 ns Package 168-pin dual lead out socket type Contact pad Gold Pin Arrangement 1 pin 10 pin 11 pin 40 pin 41 pin 84 pin 85 pin 94 pin 95 pin 124 pin 125 pin 168 pin HB56SW3272ESK-5/6 Pin No. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 Signal name Pin No. VSS DQ0 DQ1 DQ2 DQ3 VCC DQ4 DQ5 DQ6 DQ7 DQ8 VSS DQ9 DQ10 DQ11 DQ12 DQ13 VCC DQ14 DQ15 DQ16 DQ17 VSS NC NC VCC WE0 CE 0...