H9DA4GH4JJAMCR Description
and is subject to change without notice. Hynix does not assume any responsibility for use of circuits described. No patent licenses are implied.
H9DA4GH4JJAMCR Key Features
- Operation Temperature
- 30oC ~ 85oC
- Packcage
- 137-ball FBGA
- 10.5x13.0mm2, 1.2t, 0.8mm pitch
- Lead & Halogen Free [ NAND Flash ]
- Multiplane Architecture
- Supply Voltage
- Vcc = 1.7
- 1.95 V