Datasheet4U Logo Datasheet4U.com

H9DA4GH4JJAMCR Datasheet NAND 4Gb(x16) / mobile DDR 4Gb(x32 2CS)

Manufacturer: SK Hynix

📥 Download Datasheet

General Description

and is subject to change without notice.

Hynix does not assume any responsibility for use of circuits described.

No patent licenses are implied.

Overview

MCP Specification 4Gb (256Mb x16) NAND Flash + 4Gb (64Mb x32 2/CS 2CKE) mobile DDR http://www.DataSheet4U.

Key Features

  • [ MCP ].
  • Operation Temperature - -30oC ~ 85oC.
  • Packcage - 137-ball FBGA - 10.5x13.0mm2, 1.2t, 0.8mm pitch - Lead & Halogen Free [ NAND Flash ].
  • Multiplane Architecture.
  • Supply Voltage - Vcc = 1.7 - 1.95 V.
  • Memory Cell Array - (1K + 32) words x 64 pages x 4096 blocks.
  • Page Size - (1K+ 32 spare) Words.
  • Block Size - (64K + 2K spare) Words.
  • Page Read / Program - Random access : 25us (max. ) - Sequential access : 45ns (min. ) - Page program time : 250us (typ. ) -.

More Datasheets from SK Hynix

Part Number Description
H9DP32A4JJBCGR 4GB eNAND Flash(x8) + 4Gb Mobile DDR
H9DP32A4JJBCGR-KEM 4GB eNAND Flash(x8) + 4Gb Mobile DDR