H9DP32A4JJBCGR Overview
and is subject to change without notice. SK hynix does not assume any responsibility for use of circuits described. No patent licenses are implied.
H9DP32A4JJBCGR Key Features
- Operation Temperature
- (-25)oC ~ 85oC
- Package
- 153-ball FBGA
- 11.5x13.0mm2, 1.0t, 0.5mm pitch
- Lead & Halogen Free
- Packaged NAND flash memory with MultiMediaCard interface
- e-NAND system specification, pliant with V4.41
- Full backward patibility with previous eNAND system specification
- Bus mode